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W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. Gap Pad HC 3.0 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness
and/or topography.
Gap Pad HC 3.0 is offered with natural inherent tack on both sid

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