贝格斯导热材料
apPad3500ULM在非常低的压力下，低的S系列热阻，高的贴服性，S系列软度。针对低应力应用设计
玻纤增强，提高加工性能和搞斯裂性
Gap Pad 3500ULM (ultra-low modulus) is an extremely soft gap filling material with a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to
a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress.
Gap P
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11/25 13:23